Cold solder joints and dull solder joints are hidden quality problems easily occurred during reflow soldering. The solde···

Component billboarding and flipping are common placement defects in SMT production, mostly appearing on small chip parts···

Solder beads and pinholes are common process defects duringSMT printingand reflow process. They not only affect board ap···

Tombstoning is a typical common defect for chip components. One end of the component lifts away from the pad while only ···

A dry joint is a common hidden defect in SMT production. It refers to the condition that no effective solder covers the ···

Short circuit is one of the most common soldering defects in SMT production. It occurs when adjacent solder joints, circ···

Nowadays, electronic products are developing towards thinner, smaller and smarter design, driving the entire SMT industr···

With the continuous upgrading of global environmental protection regulations, lead-free soldering has become the mainstr···

Flux is an essential auxiliary material in SMT production. It is usually used with solder paste and directly affects sol···