AOI (Automatic Optical Inspection) is standard intelligent equipment for modern SMT lines. With high-definition vision a···

Stencil is the core tool for solder paste printing. As the first procedure of SMT production, printing quality is mainly···

Solder paste is a core consumable in SMT production. Proper management is critical to printing and soldering quality, an···

First Pass Yield (FPY) is a key indicator to evaluate the overall performance, process capability and quality management···

Solder joint cracks and open joints are critical reliability defects in SMT production. They usually do not appear immed···

Cold solder joints and dull solder joints are hidden quality problems easily occurred during reflow soldering. The solde···

Component billboarding and flipping are common placement defects in SMT production, mostly appearing on small chip parts···

Solder beads and pinholes are common process defects duringSMT printingand reflow process. They not only affect board ap···

Tombstoning is a typical common defect for chip components. One end of the component lifts away from the pad while only ···