Full Standard Management of SMT Solder Paste: Storage, Warm-up, Stirring and Application
2026-05-26 09:41:22 - Source：PCB Assembly
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Solder paste is a core consumable in SMT production. Proper management is critical to printing and soldering quality, and helps reduce defects like short circuits, dry joints and solder beads. Standard procedures must be followed throughout the whole process.
1. Storage Requirements
Keep solder paste sealed in dedicated refrigerators at 2℃~10℃. Freezing is forbidden. Adopt the FIFO principle and mark the expiry date clearly. Seal tightly immediately after taking to avoid moisture ingress.
2. Warm-up Rules
Do not open cold solder paste directly. Let it warm up at room temperature for 4 to 8 hours until the temperature is balanced. Keep sealed during warm-up to prevent condensed moisture which causes solder splashing and beads.
3. Stirring Operation
Stir the warmed solder paste with professional equipment for 2 to 5 minutes, until it becomes uniform and smooth. Manual random stirring is not allowed, as air bubbles will lead to pinholes and insufficient solder.
4. On-machine Usage Control
Do not keep solder paste on stencil for more than 8 consecutive hours. Re-stir or replace if overtime.
Cover the paste during production breaks to prevent dust and moisture contamination.
Never mix solder paste of different brands, models or batches.
Seal and refrigerate leftover paste daily. Re-do warm-up and stirring before reuse.
Standardized solder paste management is the first line of process control. It effectively cuts down soldering defects and maintains high production yield.
Globalwell arranges special staff to manage solder paste. We follow strict rules for storage, warm-up, stirring and usage, so as to guarantee consistent soldering performance.
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